6

Finite element analysis of a three‐dimensional package

Year:
2003
Language:
english
File:
PDF, 329 KB
english, 2003
10

Stud bump bond packaging with reduced process steps

Year:
2001
Language:
english
File:
PDF, 385 KB
english, 2001
11

Reliability of FCOB with and without encapsulation

Year:
2001
Language:
english
File:
PDF, 323 KB
english, 2001
15

Finite element analysis of a IBM suspension integrated with a PZT microactuator

Year:
2002
Language:
english
File:
PDF, 499 KB
english, 2002
18

Copper Wire Bonding || Copper Wire Bonding

Year:
2014
Language:
english
File:
PDF, 343 KB
english, 2014
33

Development of a reliable packaging process for flip chip on ceramics

Year:
2001
Language:
english
File:
PDF, 190 KB
english, 2001
34

Flip chip assemblies using gold bumps and adhesive

Year:
2001
Language:
english
File:
PDF, 252 KB
english, 2001
42

Grinding of alumina/aluminum composites

Year:
2002
Language:
english
File:
PDF, 1019 KB
english, 2002
50

Reliability of flip chips on FR‐4 assembled with reduced process steps

Year:
2001
Language:
english
File:
PDF, 1.21 MB
english, 2001